DEV-SYSTEM X230-AI (Up to 8 Cameras, Dual GbE)

2.899,00  Excl. VAT

The X230 Developer System is a powerful edge AI platform for demanding multi-camera applications based on the NVIDIA Jetson AGX Orin 64GB. It features a CSI-2 expansion port for up to 8 cameras, dual Gigabit Ethernet, an MCU watchdog, auto-flashing, and optional dual Wi-Fi, making it a professional-grade platform for industrial AI systems—ready for immediate use with a pre-flashed SSD and power supply.

SCOPE OF DELIVERY
– Carrier Board X230
– NVIDIA Jetson AGX Orin 64GB
– Heatsink + fan (80×80mm)
128 GB NVMe SSD (pre-flashed)
12V 60W Power Supply

OPTIONAL ADD-ONS
– Wi-Fi / GPS module (M.2 Key E, LM823)
– RTC Battery
– CSI-2 expansion port

 

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SKU: RB_X230OAIO Categories: ,
 

Description

The X230 Developer System brings the full performance of the NVIDIA Jetson AGX Orin 64GB to a compact, industrial-grade carrier platform (125 × 104.6 mm). At its core is a flexible CSI-2 expansion interface which—combined with compatible expansion modules—enables the simultaneous operation of up to 8 cameras. This makes the X230 Developer System ideally suited for applications such as multi-camera object detection, 360° environmental sensing in autonomous vehicles, industrial quality inspection with multiple inspection points, or scalable surveillance systems.

The NVIDIA Jetson AGX Orin 64GB delivers up to 200 TOPS of AI performance and supports the full NVIDIA SDK stack: CUDA, TensorRT, DeepStream, cuDNN, VisionWorks, and more. Dual Gigabit Ethernet with separate controllers enables simultaneous connection to multiple network segments—ideal for IT/OT separation in industrial environments.

The integrated MCU handles watchdog functions and system management independently of the operating system. Auto-flashing simplifies commissioning and field updates. Optional dual LM823 Wi-Fi modules extend the system with wireless connectivity. The system is supplied with the AGX Orin 64GB, a pre-flashed 128 GB NVMe SSD (JetPack 6.x), active cooling, and a 12 V power supply.

TECHNICAL SPECIFICATIONS

  • Module: NVIDIA Jetson AGX Orin 64GB
  • AI Performance: 275 TOPS
  • Memory: 32 GB LPDDR5
  • Carrier Board: X230 (Designed & Manufactured in Germany)
  • Ethernet: 2× 1GbE (RJ45)
  • USB 3.x: 3× USB 3.0
  • USB 2.0: 1× Micro OTG
  • CSI-2 Ports: Via expansion module – up to 8 cameras (optional)
  • M.2 Key M (NVMe): 1× 2280 – pre-flashed 128 GB
  • M.2 Key E (Wi-Fi/GPS): (LM823 Wi-Fi/GPS module)
  • M.2 Key B (LTE/5G): No
  • PCIe Expansion: PCIe x4 / x1 ext.
  • HDMI: 1× 2.0
  • CAN: 1×
  • UART: ✓
  • I2C / I2S / SPI: ✓ / ✓ / –
  • SIM Card: No
  • MCU / Watchdog: ✓
  • Crypto Chip: ✓
  • Autoflashing: ✓
  • RTC Battery: Optional
  • Onboard WLAN: Optional (2× LM823 Wi-Fi module)
  • Board Dimensions: 125 × 104.6 mm
  • Power Supply: 12V–19V
  • Cooling: AGX Orin heatsink + fan (active, 80×80mm)
  • Operating System: JetPack 6.x (pre-installed, CUDA, TensorRT, DeepStream)

Each developer board comes with access to a trial license for Iron Link — our performance vision software for computer vision, powered by hardware accelerators such as PVA, VIC, or CUDA. Are you a board developer? Request your personal Iron Link trial license and explore the full potential of accelerated computer vision on your hardware.

Learn more & request your license at: https://rebotnix.com/ironlink

AI Software & Solutions
From board to finished application: REBOTNIX offers individual board customizations, tailored AI software, and enclosures made of aluminum or plastic with custom enclosure branding for orders of 25 units or more – all from a single source, precisely tailored to your needs. Get in touch with us!

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